ZYGO ZMI-4004 Laser interference measurement module

Supply Voltage: 100-240V AC±10% (50/60Hz)

Rated Power Consumption: ≤60W (normal measurement state)

Laser Type: Helium-Neon (He-Ne) laser

Laser Wavelength: 632.8nm (±0.1nm)

Laser Output Power: 0.5mW (continuous output, CLASS II laser)

Data Interfaces: Ethernet (100Mbps), USB 3.0 (data storage)

Displacement Measurement Range: 0-10m (linear measurement mode)

Displacement Measurement Resolution: 0.1nm (full range)

Linear Measurement Accuracy: ≤0.1μm/m (20℃ ambient temperature, no air flow interference)

Flatness Measurement Range: 0-500mm×500mm (single measurement area)

Flatness Measurement Accuracy: ≤0.5nm (after reference plane calibration)

Dynamic Response Frequency: ≤1kHz (real-time data update)

Angle Measurement Range: ±10° (pitch/yaw angle)

Angle Measurement Resolution: 0.01arcsec

Operating Temperature Range: 15℃-30℃ (when temperature fluctuation ≤0.5℃/h)

Storage Temperature Range: -10℃-40℃ (non-condensing)

Relative Humidity: 30%-60% (non-condensing, when temperature ≤30℃)

Vibration Resistance: Complies with ISO 10816-3 standard (10-1000Hz, acceleration ≤1g)

EMC Compliance: Meets EN 61326-1 industrial equipment standard (Class A)

Airflow Sensitivity: ≤0.1m/s (ambient airflow velocity, airflow shield required if exceeded)

Mounting Type: Desktop fixed/tripod mounting (compatible with M12 threaded interface)

Overall Dimensions (L×W×H): 380mm×260mm×150mm (main unit)

Net Weight: 5.2kg (including laser emitter and control unit, excluding measurement accessories)

Detector Type: CCD array detector (1280×960 pixels resolution)

Measurement Accessories: Standard flat mirror (diameter 25mm, flatness ≤λ/20), corner cube mirror (right angle error ≤1arcsec)

Nanoscale Measurement Accuracy: Displacement measurement resolution reaches 0.1nm, linear accuracy ≤0.1μm/m, flatness measurement accuracy ≤0.5nm, which can capture micro-topography errors of precision components (such as semiconductor wafers, optical lenses) and meet the testing requirements of 2nm process chip manufacturing.
High Dynamic Response: The 1kHz dynamic response frequency supports real-time tracking of displacement changes of high-speed moving equipment (such as precision machine tool spindles), with no delay in data update, avoiding measurement deviations caused by motion inertia.
Long-Term Operation Stability: Laser wavelength stability ≤0.001nm/h, data drift ≤0.2nm during 8-hour continuous measurement, no frequent calibration required to maintain measurement accuracy, adapting to 7×24-hour quality testing scenarios in production lines.
Strong Environmental Adaptability: In the temperature range of 15℃-30℃ and airflow environment ≤0.1m/s, the measurement error increase is ≤5%; the EMC design can resist high-frequency interference in industrial sites, with data acquisition bit error rate ≤10⁻⁹.
Multi-Parameter Integrated Measurement: A single setup can complete displacement, flatness and angle measurement simultaneously without replacing accessories, improving measurement efficiency by 60% compared with traditional equipment and reducing the process complexity of precision component testing.