TEL TVB3101-1/ISC 1381-644957-16 1308-644957-12 control module

TEL TVB3101-1/ISC 1381-644957-16 1308-644957-12 control module

Specific Parameters

Brand TEL (Tokyo Electron, Japanese Brand)

Product Series TEL TVB Series Semiconductor Control Module

Product Type Dedicated Control Module for Semiconductor Manufacturing Equipment

Model TVB3101-1/ISC 1381-644957-16 1308-644957-12

Supply Voltage 24VDC±20%, maximum input current 0.5A

I/O Points 16 digital inputs, 16 digital outputs

Input Type Single-ended input and differential input

Output Type Relay output

Processing Speed 550μs, output frequency 100Hz

Program Capacity 300, data capacity 200

Communication Protocols Supports Ethernet, serial communication protocols

Operating Temperature Range -20℃ to +65℃

Storage Temperature Range -40℃ to +85℃

Relative Humidity 5% to 95%, No Condensation

Vibration Resistance High-level shock and vibration resistance design

Installation Method Equipment-integrated installation, compatible with TEL semiconductor equipment rack

Physical Weight Approximately 0.8kg

Core Adaptable Processes Etching, deposition, cleaning and other semiconductor manufacturing processes

Product Performance

With 550μs high-speed processing capability and 100Hz output frequency, it can quickly respond to process control commands, accurately capture subtle signal changes, realize high-precision regulation of semiconductor manufacturing processes, and meet strict process requirements.

Supports two input types (single-ended and differential) and relay output. The configuration of 16 inputs and 16 outputs can flexibly connect various sensors and actuators, adapting to diverse process control needs.

Equipped with high-level shock and vibration resistance, it can operate stably in the harsh environment of high-frequency operation of semiconductor manufacturing equipment, resist the impact of temperature and humidity fluctuations, and has excellent trouble-free operation reliability.

Compatible with Ethernet and serial communication protocols, it can be seamlessly integrated into the control system of TEL semiconductor equipment, realizing high-speed data interaction with the main control unit, supporting remote diagnosis and maintenance, and improving operation and maintenance efficiency.

The modular design facilitates equipment integration and later replacement. The program and data capacity can meet the core process control needs, supporting flexible parameter configuration to adapt to different semiconductor manufacturing scenarios.

Built-in perfect signal filtering and anti-interference mechanism, it can effectively shield complex electromagnetic interference in industrial sites, ensure accurate and stable input and output signals, and avoid product defects caused by process deviations.