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GE IC698CHS009A Core rack backplane

GE IC698CHS009A is the core rack backplane of GE PACSystems RX7i series Programmable Automation Controllers (PAC), designed for industrial-grade distributed control systems. Its core function is to provide physical installation interfaces and high-speed data transmission buses for RX7i series modules (CPU, I/O, communication, power modules). The backplane adopts a 9-slot standard design, supports redundant power module access and hot-swapping, and realizes real-time data interaction between modules via a 1.28Gbps high-speed backplane bus. It can be directly integrated into the RX7i control system rack, adapting to the strict requirements of large-scale industrial control scenarios for module expansion and data transmission efficiency. Certified with UL, CE, and CSA, it adapts to a wide temperature range of -25℃ to +70℃, and features module status monitoring and bus fault diagnosis functions. It is a core component for the RX7i system to build a high-reliability and high-scalability control platform.

GE IC698CHS009A Core rack backplane

 

Specific Parameters

Electrical Parameters

Backplane Bus: High-speed serial bus with a transmission rate of 1.28Gbps, supporting parallel data interaction between modules, bus delay ≤1μsSlot Quantity: 9 standard RX7i module slots, including 1 dedicated CPU slot (compatible with IC698CPU330/340 series CPUs) and 8 universal I/O/communication module slotsPower Supply Support: Supports dual redundant power module access (compatible with IC698PWR100/200 series power supplies); power input is distributed to each module via backplane copper bars, with voltage fluctuation tolerance of ±10%Signal Isolation: 2kVrms electrical isolation between slots; independent isolation between bus circuits and power circuits; common-mode interference immunity ≥120dBDiagnostic Functions: Built-in slot status monitoring (module presence detection, communication link on/off), bus fault alarm, power voltage monitoring; diagnostic information uploaded to the CPU module via the backplane busCompatible Modules: Supports all RX7i series modules, including CPU modules, digital/analog I/O modules, Ethernet/serial communication modules, and motion control modules

Mechanical Parameters

Overall Dimensions: 482.6mm (L) × 177.8mm (W) × 38.1mm (H), compliant with 19-inch industrial cabinet installation specificationsHousing Material: Cold-rolled steel plate (1.5mm thickness) with anti-static powder coating, featuring EMI shielding functionWeight: Approximately 2.8kgMounting Method: 19-inch standard cabinet rack-mounted installation, supporting vertical/horizontal installation; must be used with RX7i series power modules and fan modulesConnection Method: Modules connect to the backplane bus via snap-in interfaces; power modules connect via dedicated copper bar interfaces, no additional wiring required

Environmental Parameters

Operating Temperature: -25℃ to +70℃ (non-condensing environment, compliant with IEC 60068-2-1/2 standard)Storage Temperature: -40℃ to +85℃Relative Humidity: 5% to 95% (non-condensing, compliant with IEC 60068-2-3 standard)Protection Rating: IP20 (backplane itself, relying on overall cabinet protection)EMC Compliance: Meets EN 61000-6-2 (industrial environment immunity) and EN 61000-6-4 (emission limits) standardsVibration Resistance: 10-500Hz frequency range, 0.5g acceleration (sine wave), 30 minutes of continuous testing per axis

Product Performance

Efficient bus transmission: The 1.28Gbps high-speed serial bus enables microsecond-level data interaction between modules, supporting real-time data processing of 32K discrete I/O and 16K analog I/O, meeting the strict data transmission delay requirements of large-scale control systems.

Flexible expansion capability: The 9-slot design can simultaneously access 1 CPU module, 2 redundant power modules, and 6 I/O/communication modules; supports expansion to 1000+ I/O points via remote I/O links, adapting to control needs from small equipment to large factories.

High redundancy reliability: Supports hot redundant access of dual power modules, with automatic switching when a single power supply fails, switching time ≤10ms; the bus has a fault self-recovery function, and local link anomalies do not affect overall data transmission, with a mean time between failures (MTBF) ≥200,000 hours.

Excellent maintenance convenience: Modules support hot swapping, allowing replacement of I/O/communication modules without shutting down the system; built-in slot presence detection and fault diagnosis enable real-time viewing of each module’s status via the CPU module or HMI, with fault location time ≤5 minutes.

Strong environmental adaptability: The -25℃ to +70℃ wide temperature design covers alpine and high-temperature industrial scenarios (e.g., northern winter workshops, high-temperature chemical plant areas); vibration resistance and EMC design ensure stable operation in environments with dense high-power equipment.




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