AMAT 0190-49518 High precision atomic layer deposition (ALD) process module
Technical Parameter
Sedimentary capacity
Material compatibility: Supports metal oxides such as Al ₂ O3, TiO ₂, HfO ₂, Ta ₂ O ₅, as well as metal nitrides such as TiN and W.
Thickness control: Single cycle growth thickness of 0.1-1 Å, uniformity error<1% (200mm wafer).
Process temperature: Room temperature to 500 ° C, supports low-temperature deposition (such as CMOS backend integration below 100 ° C).
Process efficiency
Capacity: Processing 50-100 wafers (200mm) per hour, supporting parallel processing of multiple batches.
Gas management: Pulse gas injection (N ₂ purge interval<50ms) is adopted, with precursor utilization rate>90%.
Interface and Control
Communication protocol: Supports SECS/GEM standards and can seamlessly integrate with factory MES systems.
Real time monitoring: Integrated in-situ ellipsometry to achieve real-time feedback on film thickness and composition.
Physical specifications
Size: 1.8m × 1.5m × 2.2m (including gas cabinet), weight approximately 2.5 tons.
Environmental requirements: Cleanroom Class 1, vibration<50 μ m, power supply 480V three-phase AC.
Product Performance
Conformance and uniformity
High aspect ratio coverage: Achieving atomic level conformal deposition in 3D NAND deep holes (aspect ratio>100:1) to ensure consistent interlayer electrical performance.
Repeatability between wafers: The thickness fluctuation between batches is less than 0.5%, meeting the requirements of large-scale production.
Process flexibility
Multi material stacking: supports complex multilayer thin film structures (such as Al ₂ O ∝/TiO ₂ alternating stacking), suitable for emerging storage technologies such as MRAM and FeFET.
Formula management: Built in 1000+process formula templates, supporting quick switching between different materials and thickness requirements.
Safety and reliability
Chemical handling: equipped with inert gas encapsulation and leak detection system to ensure the safe use of flammable/toxic precursors (such as TMA, WF ₆).
Maintenance design: The modular structure supports online replacement of 90% of components, with an average repair time (MTTR) of less than 30 minutes.
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